AS Published on Saturday 27 August 2016 - n° 157 - Categories:R&D
New brochure presented by 1366 Technologies
The American company 1366 Technologies, which has developed a moulded silicon wafer (instead of a sawn wafer with a thickness of 180 to 200 microns), has just developed a wafer with an average thickness of 100 to 120 microns and an edge
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